Process

Item

Capability

Material

Shengyi, Union, Sunlight, Rogers, Panasonic, Taiflex,Taconic, Arlon, I-Teraetc etc

Panelization

Max. Panel Size

500mm × 600mm

Lamination

Number of Layers

4–62 layers

Inner Layer

Min. Trace width/spacing

2mil / 2mil

Base Copper Thickness

1/3oz – 6oz

Layer-to-Layer Registration Tolerance

±0.05mm

Inner Layer Hole-to-Trace Clearance

0.025mm

Inner Layer Registration Tolerance

0.33mm

Inner Layer Pattern-to-Edge Clearance

0.5mm

 Drilling

Min. Drill Size

3.8mil

Max. Drill Size

152.4mil

Min. Finished Hole Size

2.54mil

Gold Plated Hole Size Tolerance

±3mil

Non-Plated Hole Size Tolerance

±2mil

Aspect Ratio

10:01

Outer Layer

Min. Trace width/Spacing

0.076mm / 0.076mm

Base Copper Thickness

1/3oz – 12oz

Layer-to-Layer Registration Tolerance

±0.05mm

Impedance Control Tolerance

±10%

CPU Trace-to-Board Edge Clearance

0.4mm

Min. distance from annular ring to edge

0.15mm / 0.15mm

Trace-to-Trace Clearance

0.08mm

Trace-to-Pad Clearance

0.1mm

Pad-to-Pad Clearance

0.1mm

Solder Mask

Solder Mask Opening-to-Trace Clearance

0.1mm

Min. Solder Mask Bridge

0.1mm

Solder Mask Registration Tolerance

±0.05mm

Silkscreen

Min. Character Width

0.13mm

Min. Character Height

0.8mm

 Surface Finish

OSP Thickness

0.2 – 0.5μm

Immersion Silver Thickness

0.8 – 1.0μm

Lead-free HASL Thickness

0.8 – 1.0μm

Gold Plating Thickness

≥1.0μm

Nickel Plating Thickness

0.005mm

Profile

Min. Routing Tool Size

0.8mm

Max. Routing Tool Size

1.6mm

Routing Accuracy

0.1mm

Punching Accuracy

0.05mm

V-CUT Angle Tolerance

±5°

V-CUT Residual Thickness Tolerance

±0.05mm

Min. V-CUT Size

30mm × 30mm

Min. Board Outline Size (Punch)

1.0mm

 Finished Product

Min. Board Thickness

0.2mm

Max. Board Thickness

8.0mm

Board Warpage Tolerance

≤0.5%