To provide an accurate quote, please share:

1. Gerber files (RS-274X / ODB++)

2. Bill of Materials (BOM), if assembly is required

3. Quantity and lead time requirements

4. Plate material

5. Board(PCB) layers

6. The thickness of copper(including top and bottom)

7. Solder mask treatment for vias：via tenting or via filling or open to pad?或者tented vias or via filled or open vias?

8. Solder mask color: Green

9. Silkscreen color

10. Surface finish: Immersion gold(ENIG) or lead-free tin spray?

11. Panelization: Is it required? If yes, please provide the panelization details. If no, do you need a 4mm or 5mm process edge on both sides or forth sides for the SMT process?

12. Special requirements (impedance control, etc.)