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  • FR-4 + RO mixed laminated PCB

FR-4 + RO mixed laminated PCB

FR-4 + RO mixed laminated PCB

In the manufacturing of PCBs, the lamination process usually refers to the stacking of copper foil, semi cured sheet, and pre wired core board (inner layer) in a certain order, and then using a press machine to first heat press and integrate them under high temperature and high pressure conditions, and then cold press to release stress and ensure the flatness of the product.

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  • Product Details

Product introduction

In PCB manufacturing, the lamination process typically involves stacking copper foil, prepreg, and the pre-wired core (inner layer) in a specific order. The lamination process then passes through a press, initially hot-pressing the layers under high temperature and pressure to fuse them together. Cold-pressing then releases stress and ensures a flat product.

PCB is a crucial component in the electronics industry. Virtually every electronic device, from watches and calculators to computers and communications equipment, requires a PCB to interconnect electronic components such as integrated circuits.


Product parameters

Product display

  • 多层通孔板展示一

    多层通孔板展示一
  • 多层通孔板展示二

    多层通孔板展示二
  • 多层通孔板展示三

    多层通孔板展示三
  • 多层通孔板展示四

    多层通孔板展示四
  • 多层通孔板展示五

    多层通孔板展示五

Hot Product

Mixed laminated PCB

Mixed laminated PCB

In PCB manufacturing, the lamination process typically involves stacking copper foil, prepreg, and the pre-wired core (i...
FR-4 +RO mixed laminated PCB

FR-4 +RO mixed laminated PCB

In PCB manufacturing, the lamination process typically involves stacking copper foil, prepreg, and the pre-wired core (i...
FR-4 + RO mixed laminated PCB

FR-4 + RO mixed laminated PCB

In PCB manufacturing, the lamination process typically involves stacking copper foil, prepreg, and the pre-wired core (i...