Uses high-frequency materials with low dielectric constant (Low Dk) and low dissipation factor (Low Df) to ensure signal integrity. Designed for long-term continuous operation of communication equipment, with excellent heat resistance and mechanical strength. Often integrates blind vias, buried vias, and microvias to achieve higher routing density. Optimized stack-up design reduces crosstalk and electromagnetic interference (EMI). Widely used in 5G base stations, optical transmission equipment, data centers, and high-speed routers.