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Production process of rigid-flex PCB

Date:2025-06-27

01 Design Board Acceptance

 

The factory's engineering department receives and inspects the design board files sent by the customer.

 

This inspection includes: ensuring the design files are appropriate, whether any layers are missing, ensuring the files have borders, and whether the drill files are present.

 

If there are any design flaws, the engineering department will notify the designer and ask them to make revisions. If there are no design issues, mass production can proceed as planned.

 

02 Printing the Design on Transparencies

 

The inspected design files are printed on transparencies.

 

Light is projected onto these films, exposing the photoresist on the circuit board in a manner similar to photographic exposure. The resulting circuit board design is like a film, vivid and lifelike.

 

03 Cutting and Edge Grinding of Fiberglass

 

Fiberglass is selected, cut, and ground.

 

FR-4 fiberglass with copper top and bottom layers is selected and cut to the design dimensions on a cutting machine. Because the fiberglass edges are too rough, they need to be polished.

 

04 Fabricating the Inner Layers

 

The top and bottom fiberglass layers are covered with a plastic dry film and hardened under UV light.

 

After both sides of the fiberglass are hardened with a dry film, they are mechanically pressed together to effectively prevent the copper from being dissolved by alkaline solutions in subsequent processes.

 

05 Etching Process

 

The entire etching process removes excess copper and photoresist from the copper plate, completing the PCB prototype through a series of steps.

 

Excess copper and photoresist are removed from the interlayer fiberglass, and the etching process is completed after rinsing with an alkaline solution. Finally, a combination of stripping, water washing, drying, and drying the plate completes the etching process.

 

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06 Automated Optical Inspection (AOI) and Vacuum Clamping (PP)

The AOI checks the etching of the inner layers to ensure that they are properly etched.

The vacuum clamping process involves applying a yellow epoxy-like patch to the side of the board to enhance adhesion.